Abstract
Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis.
| Original language | English |
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| Pages | 37-39 |
| Number of pages | 3 |
| Publication status | Published - 1995 |
| Event | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA Duration: 1995 Oct 2 → 1995 Oct 4 |
Other
| Other | Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| City | Portland, OR, USA |
| Period | 95/10/2 → 95/10/4 |
All Science Journal Classification (ASJC) codes
- General Engineering