An increase in the demand for completely foldable electronics has motivated efforts for the development of conducting polymer electrodes having extraordinary mechanical stability. However, weak physical adhesion at intrinsic heterojunctions has been a challenge in foldable electronics. This paper reports the completely foldable polymer thin-film transistors (PTFTs) and logic gate arrays. Homojunction-based PTFTs were fabricated by selectively doping p-type diketopyrrolopyrrole-based semiconducting polymer films with FeCl3 to form source/drain electrodes. The doping process caused a gradual work function change with depth, which promoted charge injection to semiconducting regions and provided a low contact resistance. In addition, the interfacial adhesion in the PTFTs was improved by interfacial cross-linking between adjacent component layers. The electrical performance of the resulting PTFTs was maintained without noticeable degradation even after extreme folding, suggesting that the proposed fabrication strategy can further be applied to various semiconducting polymers for the realization of foldable electronics.
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