Signal integrity and EMI quality are compared between microstrip and stripline for split reference plane of multi-layer PCB. Designing high-speed digital signal as stripline proved to be a solution to minimize the effect of nonideal current return path. Simulations based on 3D-FDTD method are utilized for the analysis of practical high frequency multi-layered PCB.
|Number of pages
|IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
|Published - 2004
|IEEE Antennas and Propagation Society Symposium 2004 Digest held in Conjunction with: USNC/URSI National Radio Science Meeting - Monterey, CA, United States
Duration: 2004 Jun 20 → 2004 Jun 25
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering