Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages

George E. Ponchak; Donghoon Chen; Jong Gwan Yook; Linda P.B. Katehi

Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages

George E. Ponchak, Donghoon Chen, Jong Gwan Yook, Linda P.B. Katehi

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Conference article › peer-review

19 Citations (Scopus)

Abstract

Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.

Original language	English
Pages (from-to)	1831-1834
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	3
Publication status	Published - 1998
Event	Proceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Baltimore, MD, USA Duration: 1998 Jun 7 → 1998 Jun 12

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

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title = "Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages",

abstract = "Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.",

author = "Ponchak, {George E.} and Donghoon Chen and Yook, {Jong Gwan} and Katehi, {Linda P.B.}",

year = "1998",

language = "English",

volume = "3",

pages = "1831--1834",

journal = "IEEE MTT-S International Microwave Symposium Digest",

issn = "0149-645X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) ; Conference date: 07-06-1998 Through 12-06-1998",

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T1 - Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages

AU - Ponchak, George E.

AU - Chen, Donghoon

AU - Yook, Jong Gwan

AU - Katehi, Linda P.B.

PY - 1998

Y1 - 1998

N2 - Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.

AB - Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.

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M3 - Conference article

AN - SCOPUS:0031638396

SN - 0149-645X

VL - 3

SP - 1831

EP - 1834

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

T2 - Proceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)

Y2 - 7 June 1998 through 12 June 1998

ER -

Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages

Abstract

All Science Journal Classification (ASJC) codes

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