Application of system-level em modeling to high-speed digital 1C packages and PCB's

Jong Gwan Yook, Linda P.B. Katehi, Karem A. Sakallah, Ray S. Martin, Lilly Huang, Tim A. Schreyer

Research output: Contribution to journalArticlepeer-review

32 Citations (Scopus)


A system-level electromagnetic (EM) modeling tool combining a three-dimensional (3-D) full-wave finite-element EMfield analysis tool and a time-domain electric-circuit simulator is developed and applied to various geometries such as multilayer printed circuit boards (PCB's), signal lines embedded in a PCB or package, and split power-distribution network. Since the signal integrity is a primary concern of high-speed digital circuits, the noise distributions on various circuit planes are evaluated from the analysis. These noise distributions, often called noice maps, are utilized to identify the location of the major source of simultaneous switching noise (SSN). This information can eventually be adapted for optimum placement of decoupling capacitors to minimize the noise fluctuations on the various circuit planes on an entire PCB.

Original languageEnglish
Pages (from-to)1847-1856
Number of pages10
JournalIEEE Transactions on Microwave Theory and Techniques
Issue number10 PART 2
Publication statusPublished - 1997

Bibliographical note

Funding Information:
Manuscript received February 25, 1997; revised June 6, 1997. This work was supported under a grant from Intel Corporation. J.-G. Yook, L. P. B. Katehi, and K. A. Sakallah are with the Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109-2122 USA. R. S. Martin, L. Huang, and T. A. Schreyer are with the Intel Corporation, Hillsboro, OR 97124-5961 USA. Publisher Item Identifier S 0018-9480(97)07387-0.

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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