Application of single asperity abrasion process for surface micro-machining

J. M. Lee, W. H. Jin, D. E. Kim

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)


Basic understanding of asperity interaction with the counter surface during an abrasive wear process may be utilized to develop a precision machining process. This concept is implemented in this work using a diamond tip as the cutting tool and coated silicon wafer and metal specimens as the workpiece. The tip acts as a single asperity abrading the counter surface during the contact sliding motion. A precision machine based on computer numerical control was designed and built to perform such an abrasion process. The machine was instrumented to monitor the normal and frictional forces during the abrasion process. By optimizing the contact and sliding conditions the workpiece material could be removed at the micrometer scale. This technique was successfully developed to machine SiO2 resist material coated on silicon wafer. Subsequent processing of the silicon by chemical etching produced micro-grooves that could otherwise be fabricated only by more complicated and capital intensive photolithographic methods. Also, in a different process, by feeding the diamond tip in the direction perpendicular to the sliding direction after each path, 100 x 100 μm square pockets with recess steps of 2 μm could be successfully fabricated on a brass surface. This intricate pattern can be used as a tool for molding micro-parts. This work demonstrates the capability of single asperity abrasion process in surface micro-machining.

Original languageEnglish
Pages (from-to)1133-1143
Number of pages11
Issue numberPART 2
Publication statusPublished - 2001 Oct

Bibliographical note

Funding Information:
This work was supported by the Intelligent Microsystem Center (No. 3-3-12) and the Korea Ministry of Education through Mechanical Engineering Research Fund (1998-2-0055). The authors are grateful for their support.

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry


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