TY - JOUR
T1 - Angle resolved X-ray photoelectron spectroscopic analysis on the surface of wet-etched copper
AU - Kang, Min Gu
AU - Jo, Moon Ho
AU - Park, Hyung Ho
AU - Kim, Chan Ho
PY - 1996/7
Y1 - 1996/7
N2 - Thermally evaporated copper was chemically etched with 3.5M CuCl2 + 0.5M HCl + 0.5M KCl solution at room temperature. X-ray photoelectron spectroscopy (XPS) was used to characterize the surface chemical bonding states. The result shows that chemically etched copper surface is composed of carbon, oxygen, chlorine, and copper. The bonding state of the surface has been known to be indistinguishable due to their small chemical shift in the photoelectron spectra. However, using the nondestructive angle resolved XPS technique the distribution of bonding states was revealed. They could be completely distinguished through the qualitative and quantitative comparison of related bonding states in the observed elements. After air exposure of wet etched Cu for 2 days, the bonding state of the surface was also analyzed quantitatively through photoelectron and Auger electron spectroscopic works.
AB - Thermally evaporated copper was chemically etched with 3.5M CuCl2 + 0.5M HCl + 0.5M KCl solution at room temperature. X-ray photoelectron spectroscopy (XPS) was used to characterize the surface chemical bonding states. The result shows that chemically etched copper surface is composed of carbon, oxygen, chlorine, and copper. The bonding state of the surface has been known to be indistinguishable due to their small chemical shift in the photoelectron spectra. However, using the nondestructive angle resolved XPS technique the distribution of bonding states was revealed. They could be completely distinguished through the qualitative and quantitative comparison of related bonding states in the observed elements. After air exposure of wet etched Cu for 2 days, the bonding state of the surface was also analyzed quantitatively through photoelectron and Auger electron spectroscopic works.
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U2 - 10.1143/jjap.35.3869
DO - 10.1143/jjap.35.3869
M3 - Article
AN - SCOPUS:0030196065
SN - 0021-4922
VL - 35
SP - 3869
EP - 3875
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - 7
ER -