Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

Yi Qi Wang; Byung Han Ko; Sang Geuk Jeong; Kyoung Su Park; No Cheol Park; Young Pil Park

doi:10.1007/s00542-015-2493-8

Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

Yi Qi Wang, Byung Han Ko, Sang Geuk Jeong, Kyoung Su Park, No Cheol Park, Young Pil Park

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.

Original language	English
Pages (from-to)	2565-2571
Number of pages	7
Journal	Microsystem Technologies
Volume	21
Issue number	12
DOIs	https://doi.org/10.1007/s00542-015-2493-8
Publication status	Published - 2015 Mar 27

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (2013R1A2A1A01016979).

Publisher Copyright:
© 2015, Springer-Verlag Berlin Heidelberg.

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Hardware and Architecture
Electrical and Electronic Engineering

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10.1007/s00542-015-2493-8

Cite this

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title = "Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration",

abstract = "Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.",

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AU - Park, No Cheol

AU - Park, Young Pil

N1 - Funding Information: This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korean government (2013R1A2A1A01016979). Publisher Copyright: © 2015, Springer-Verlag Berlin Heidelberg.

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N2 - Owing to their superior electrical performance, multilayer ceramic capacitors (MLCCs) are widely applied in a variety of electronic devices. The acoustic noise of MLCCs is an important factor to be considered when selecting MLCCs for specific applications, such as smart phones. This noise is directly related to the vibration of the printed circuit board (PCB) on which MLCCs are mounted. Therefore, to improve the noise and vibration characteristics, this paper investigated the effects of soldering parameters on PCB vibration. Based on the findings, a novel soldering method that reduces vibration is described.

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Analysis of the influence of soldering parameters on multi-layer ceramic capacitor vibration

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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