Abstract
Acoustic noise generated by a multi-layer ceramic capacitor (MLCC) makes users uncomfortable, so the problem must be analyzed to reduce the noise. There is a correlation between the acoustic noise and the vibration of MLCCs and the circuit board. Therefore, the acoustic noise problem must be investigated from a vibration perspective. In this study, the acoustic noise-generating mechanism was investigated, and the relationship between the characteristics of the noise and the dynamic characteristics of the circuit board with MLCC was analyzed. And a correlation criterion was proposed to predict the acoustic noise using the vibration response of the circuit board.
Original language | English |
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Pages (from-to) | 1671-1677 |
Number of pages | 7 |
Journal | Microsystem Technologies |
Volume | 20 |
Issue number | 8-9 |
DOIs | |
Publication status | Published - 2014 Aug |
Bibliographical note
Funding Information:This study was supported by the Samsung Electro-Mechanics Co., Ltd. (No. 2012-8-1793).
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Hardware and Architecture
- Electrical and Electronic Engineering