Abstract
An efficient self post package repair algorithm using on-chip-ECC is proposed and the circuit implementation details are presented. The proposed algorithm identifies and stores the addresses of hard fault detected by on-chip-ECC during post package test phase and performs subsequent repairs with changing supply voltage level controlled by tester. A yield improvement by 1∼1.5% is expected and the efficiency of test and repair steps is enhanced by about 58∼67%. The chip size overhead for its implementation is estimated to be under 0.4% for an 80nm 1Gb memory.
Original language | English |
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Pages | 331-334 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 2006 |
Event | 2006 IEEE Asian Solid-State Circuits Conference, ASSCC 2006 - Hangzhou, China Duration: 2006 Nov 13 → 2006 Nov 15 |
Other
Other | 2006 IEEE Asian Solid-State Circuits Conference, ASSCC 2006 |
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Country/Territory | China |
City | Hangzhou |
Period | 06/11/13 → 06/11/15 |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials