TY - GEN
T1 - Additive mobility enhancement and off-state current reduction in SiGe channel pMOSFETs with optimized Si cap and high-k metal gate stacks
AU - Oh, Jungwoo
AU - Majhi, Prashant
AU - Jammy, Raj
AU - Joe, Raymond
AU - Dip, Anthony
AU - Sugawara, Takuya
AU - Akasaka, Yasushi
AU - Kaitsuka, Takanobu
AU - Arikado, Tsunetoshi
AU - Tomoyasu, Masayuki
PY - 2009
Y1 - 2009
N2 - We have demonstrated high mobility pMOSFETs on high quality epitaxial SiGe films selectively grown on Si (100) substrates. With a Si cap processed on SiGe channels, HfSiO2 high-k gate dielectrics exhibited low C-V hysteresis (<10 mV), interface trap density (7.5×1010), and gate leakage current (∼10-2 A/cm2 at an EOT of 13.4Å), which are comparable to gate stack on Si channels. The mobility enhancement afforded intrinsically by the SiGe channel (60%) is further increased by a Si cap (40%) process, resulting in a combined ∼100% enhancement over Si channels. The Si cap process also mitigates the low potential barrier issues of SiGe channels, which are major causes of the high off-state current of small bandgap energy SiGe pMOSFETs, by improving gate control over the channel.
AB - We have demonstrated high mobility pMOSFETs on high quality epitaxial SiGe films selectively grown on Si (100) substrates. With a Si cap processed on SiGe channels, HfSiO2 high-k gate dielectrics exhibited low C-V hysteresis (<10 mV), interface trap density (7.5×1010), and gate leakage current (∼10-2 A/cm2 at an EOT of 13.4Å), which are comparable to gate stack on Si channels. The mobility enhancement afforded intrinsically by the SiGe channel (60%) is further increased by a Si cap (40%) process, resulting in a combined ∼100% enhancement over Si channels. The Si cap process also mitigates the low potential barrier issues of SiGe channels, which are major causes of the high off-state current of small bandgap energy SiGe pMOSFETs, by improving gate control over the channel.
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U2 - 10.1109/VTSA.2009.5159274
DO - 10.1109/VTSA.2009.5159274
M3 - Conference contribution
AN - SCOPUS:77950143676
SN - 9781424427857
T3 - International Symposium on VLSI Technology, Systems, and Applications, Proceedings
SP - 22
EP - 23
BT - 2009 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA '09
T2 - 2009 International Symposium on VLSI Technology, Systems, and Applications, VLSI-TSA '09
Y2 - 27 April 2009 through 29 April 2009
ER -