A structure design of HTS current leads with respect to the structure of coated conductor and the current terminal

Ki Sung Chang, Jae Young Jang, Suk Jin Choi, Hyun Chul Jo, Young Jae Kim, Min Cheol Ahn, Ho Min Kim, Tae Kuk Ko

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

High temperature superconductor (HTS) is a promising material as current leads for large current applications, because it has zero resistance. However, a single HTS tape has limitation on the capacity of current rating due to the critical current of the HTS tape. Therefore, stacking or parallel structure of the HTS tapes is inevitable in high temperature superconducting current leads (HTSCLs) for large current application. In this paper, several stacking methods with respect to the shape of the current terminal and the structure of the HTS tape are studied and the characteristics of the stacked samples are investigated by experimental analysis. The critical currents of the HTS modules were measured and the conductive heat leakage of a stabilizer layer was calculated. From this analysis, the characteristics of the current distribution and decrease in the critical current of HTS modules with respect to the shape of the current terminal were obtained. Based on the results, the required stacking number of the HTS tapes for certain operating current HTSCLs can be calculated.

Original languageEnglish
Article number5674100
Pages (from-to)3013-3016
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume21
Issue number3 PART 3
DOIs
Publication statusPublished - 2011 Jun

Bibliographical note

Funding Information:
Manuscript received August 03, 2010; accepted October 15, 2010. Date of publication December 23, 2010; date of current version May 27, 2011. This research was supported by National R&D Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (2009-0082742).

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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