A Miniaturized Wireless Neural Implant with Body-Coupled Data Transmission and Power Delivery for Freely Behaving Animals

Changuk Lee, Byeongseol Kim, Jejung Kim, Sangwon Lee, Taejune Jeon, Woojun Choi, Sunggu Yang, Jong Hyun Ahn, Joonsung Bae, Youngcheol Chae

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Miniaturized neural implants for monitoring neurological disorders have been investigated as a promising alternative to the neural interface for patients. However, such implants rely on physical tethers to external hardware for data and power transmission, which not only causes tissue damage and infection, but also hinders stable in vivo recordings in freely behaving animals. To enable non-tethered implants, a key feature for the robust and high-fidelity neural interface, neural implants using various wireless technologies have been reported (Fig. 20.5.1, top-left) [1]-[3]. However, the use of an inductive link [1] imposes a stringent requirement on the alignment between coils, as well as a limited transfer range. Optical [2] and ultrasound [3] telemetry suffer from attenuation from skull absorption, which requires surgically placed sub-cranial repeater or has only been demonstrated at low data rates (tens of kb/s). Hence, they are limited to the short operation range and the susceptibility to orientation, and in most cases still need a headstage that restricts freedom of action.

Original languageEnglish
Title of host publication2022 IEEE International Solid-State Circuits Conference, ISSCC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages340-342
Number of pages3
ISBN (Electronic)9781665428002
DOIs
Publication statusPublished - 2022
Event2022 IEEE International Solid-State Circuits Conference, ISSCC 2022 - San Francisco, United States
Duration: 2022 Feb 202022 Feb 26

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume2022-February
ISSN (Print)0193-6530

Conference

Conference2022 IEEE International Solid-State Circuits Conference, ISSCC 2022
Country/TerritoryUnited States
CitySan Francisco
Period22/2/2022/2/26

Bibliographical note

Publisher Copyright:
© 2022 IEEE.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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