A maximum feasible subsystem for globally optimal 3D point cloud registration

Chanki Yu, Da Young Ju

Research output: Contribution to journalArticlepeer-review

19 Citations (Scopus)


In this paper, a globally optimal algorithm based on a maximum feasible subsystem framework is proposed for robust pairwise registration of point cloud data. Registration is formulated as a branch-and-bound problem with mixed-integer linear programming. Among the putative matches of three-dimensional (3D) features between two sets of range data, the proposed algorithm finds the maximum number of geometrically correct correspondences in the presence of incorrect matches, and it estimates the transformation parameters in a globally optimal manner. The optimization requires no initialization of transformation parameters. Experimental results demonstrated that the presented algorithm was more accurate and reliable than state-of-the-art registration methods and showed robustness against severe outliers/mismatches. This global optimization technique was highly effective, even when the geometric overlap between the datasets was very small.

Original languageEnglish
Article number544
JournalSensors (Switzerland)
Issue number2
Publication statusPublished - 2018 Feb 10

Bibliographical note

Funding Information:
Acknowledgments: This research was partly supported by the Ministry of Culture, Sports and Tourism (MCST) and the Korea Creative Content Agency (KOCCA) in the Culture Technology (CT) Research & Development Program 2015. This work was partly supported by the Technology Innovation Program (10079996, Development of HVI technology for autonomous vehicle driver status monitoring and situation detection) funded By the Ministry of Trade, Industry & Energy (MOTIE, Korea).

Publisher Copyright:
© 2018 by the authors. Licensee MDPI, Basel, Switzerland.

All Science Journal Classification (ASJC) codes

  • Analytical Chemistry
  • Information Systems
  • Atomic and Molecular Physics, and Optics
  • Biochemistry
  • Instrumentation
  • Electrical and Electronic Engineering


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