TY - JOUR
T1 - A high-speed optical multi-drop bus for computer interconnections
AU - Tan, Michael
AU - Rosenberg, Paul
AU - Yeo, Jong Souk
AU - McLaren, Moray
AU - Mathai, Sagi
AU - Morris, Terry
AU - Kuo, Huei Pei
AU - Straznicky, Joseph
AU - Jouppi, Norman P.
AU - Wang, Shih Yuan
PY - 2009/6
Y1 - 2009/6
N2 - Buses have historically provided a flexible communications structure in computer systems. However, signal integrity constraints of high-speed electronics have made multi-drop electrical buses infeasible. Instead, we propose an optical data bus for computer interconnections. It has two sets of optical waveguides, one as a fan-out and the other as a fan-in, that are used to interconnect different modules attached to the bus. A master module transmits optical signals which are received by all the slave modules attached to the bus. Each slave module in turn sends data back on the bus to the master module. Arrays of lasers, photodetectors, waveguides, microlenses, beamsplitters, and Tx/Rx integrated circuits are used to realize the optical data bus. With 1 mW of laser power, we are able to interconnect eight different modules at 10 Gb/s per channel. An aggregate bandwidth of over 25 GB/s is achievable with 10-bit wide signaling paths.
AB - Buses have historically provided a flexible communications structure in computer systems. However, signal integrity constraints of high-speed electronics have made multi-drop electrical buses infeasible. Instead, we propose an optical data bus for computer interconnections. It has two sets of optical waveguides, one as a fan-out and the other as a fan-in, that are used to interconnect different modules attached to the bus. A master module transmits optical signals which are received by all the slave modules attached to the bus. Each slave module in turn sends data back on the bus to the master module. Arrays of lasers, photodetectors, waveguides, microlenses, beamsplitters, and Tx/Rx integrated circuits are used to realize the optical data bus. With 1 mW of laser power, we are able to interconnect eight different modules at 10 Gb/s per channel. An aggregate bandwidth of over 25 GB/s is achievable with 10-bit wide signaling paths.
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U2 - 10.1007/s00339-009-5162-x
DO - 10.1007/s00339-009-5162-x
M3 - Article
AN - SCOPUS:67649132614
SN - 0947-8396
VL - 95
SP - 945
EP - 953
JO - Applied Physics A: Materials Science and Processing
JF - Applied Physics A: Materials Science and Processing
IS - 4
ER -