Abstract
A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.
| Original language | English |
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| Pages (from-to) | 1615-1620 |
| Number of pages | 6 |
| Journal | Transactions of the Korean Institute of Electrical Engineers |
| Volume | 59 |
| Issue number | 9 |
| Publication status | Published - 2010 Sept |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering