TY - GEN
T1 - A 3.4μW CMOS image sensor with embedded feature-extraction algorithm for motion-triggered object-of-interest imaging
AU - Choi, Jaehyuk
AU - Park, Seokjun
AU - Cho, Jihyun
AU - Yoon, Euisik
PY - 2013
Y1 - 2013
N2 - Distributed sensor nodes typically operate under the constraint of limited energy source, and power consumption is an important factor to extend the lifetime of sensor systems. Several low-power imagers have been reported for application to wireless sensor networks [1,2]. However, the biggest power consumption comes from wireless signal transmission due to the large bandwidth of image signals [3]. One way to reduce the bandwidth is to generate signals only when an event happens, by monitoring temporal changes [3-5]. However, this event-based imaging has extraneous redundancy because the sensor may also respond to environmental conditions, such as change of illumination or background movement in addition to actual target objects.
AB - Distributed sensor nodes typically operate under the constraint of limited energy source, and power consumption is an important factor to extend the lifetime of sensor systems. Several low-power imagers have been reported for application to wireless sensor networks [1,2]. However, the biggest power consumption comes from wireless signal transmission due to the large bandwidth of image signals [3]. One way to reduce the bandwidth is to generate signals only when an event happens, by monitoring temporal changes [3-5]. However, this event-based imaging has extraneous redundancy because the sensor may also respond to environmental conditions, such as change of illumination or background movement in addition to actual target objects.
UR - http://www.scopus.com/inward/record.url?scp=84876547582&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84876547582&partnerID=8YFLogxK
U2 - 10.1109/ISSCC.2013.6487822
DO - 10.1109/ISSCC.2013.6487822
M3 - Conference contribution
AN - SCOPUS:84876547582
SN - 9781467345132
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 478
EP - 479
BT - 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
T2 - 2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
Y2 - 17 February 2013 through 21 February 2013
ER -