A 3 dimensional built-in self-repair scheme for yield improvement of 3 dimensional memories

Wooheon Kang, Changwook Lee, Hyunyul Lim, Sungho Kang

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)


A 3-dimensional Built-In Self-Repair (3D BISR) scheme is proposed for 3-dimensional (3D) memories. The proposed 3D BISR scheme consists of two phases: a parallel test-repair phase, and a serial test-repair phase. After all memory dice are simultaneously tested, only the faulty memory dice are serially tested and repaired using one Built-In Redundancy Analysis (BIRA) module. Thus, it is a faster test-repair with low area overhead. The proposed BIRA algorithm with a post-share redundancy scheme performs exhaustive searches for all combinations of spare rows and columns. Experimental results show that the proposed 3D BISR is up to two times faster than the 3D serial test-serial repair BISR when seven 2048 × 2048 bit memory dice are stacked. The proposed 3D BISR requires 44.55% of the area in comparison to a 3D parallel test-parallel repair BISR for four stacked memory dice (one 128 K RAM, two 256 K RAMs, and 512 K RAM). The yield of 3D memories is the highest due to the exhaustive search BIRA algorithm with the post-share redundancy scheme as shown in various experimental results.

Original languageEnglish
Article number7061513
Pages (from-to)586-595
Number of pages10
JournalIEEE Transactions on Reliability
Issue number2
Publication statusPublished - 2015 Jun 1

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

All Science Journal Classification (ASJC) codes

  • Safety, Risk, Reliability and Quality
  • Electrical and Electronic Engineering


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