60GHz beamforming using in-package bondwire antenna array

Y. S. Jeong; M. K. Kang; T. W. Kim

doi:10.1049/el.2010.1133

60GHz beamforming using in-package bondwire antenna array

Y. S. Jeong, M. K. Kang, T. W. Kim

Department of Electrical and Electronic Engineering

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

An antenna array using in-package bondwire to perform beamforming for 60GHz applications is presented. 1 mil gold bondwire designed to resonate at 60GHz was employed as an antenna array to provide smaller area and a cheaper way to manufacture it. The overall size of the bondwire antenna array on a CMOS chip is 1×3mm² and its radiation pattern shows fair agreement with simulation results.

Original language	English
Pages (from-to)	1047-1048
Number of pages	2
Journal	Electronics Letters
Volume	46
Issue number	15
DOIs	https://doi.org/10.1049/el.2010.1133
Publication status	Published - 2010 Jul 22

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1049/el.2010.1133

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title = "60GHz beamforming using in-package bondwire antenna array",

abstract = "An antenna array using in-package bondwire to perform beamforming for 60GHz applications is presented. 1 mil gold bondwire designed to resonate at 60GHz was employed as an antenna array to provide smaller area and a cheaper way to manufacture it. The overall size of the bondwire antenna array on a CMOS chip is 1×3mm2 and its radiation pattern shows fair agreement with simulation results.",

author = "Jeong, {Y. S.} and Kang, {M. K.} and Kim, {T. W.}",

year = "2010",

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AU - Kim, T. W.

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60GHz beamforming using in-package bondwire antenna array

Abstract

All Science Journal Classification (ASJC) codes

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