3-D Probe: Low-cost variation modeling using intertest-item correlations

Jaeyong Chung, Yonghyun Kim, Joon Sung Yang

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


Process variation models for variation tolerant designs are developed through expensive silicon characterization. This paper presents a low-cost variation characterization method that takes advantage of correlations between test items. The proposed method is based on compressed sensing (CS), a new innovative theory in signal processing and information theory, and we formulate the problem of accounting for the correlations in the form of standard CS problems, allowing us to leverage advances in CS theory. We consider wafer-level measurement results for multiple test items a 3-D signal and propose the sparsifying transform that combines the 2-D discrete cosine transform and the Karhunen-Loéve transform. Our experimental results show that the proposed method reduces the number of samples required for the same accuracy up to 2X compared to virtual probe when two test items are used.

Original languageEnglish
Article number6918480
Pages (from-to)2005-2009
Number of pages5
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Issue number12
Publication statusPublished - 2014 Dec

Bibliographical note

Publisher Copyright:
© 2014 IEEE.

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering


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