2D MoS2 Charge Injection Memory Transistors Utilizing Hetero-Stack SiO2/HfO2 Dielectrics and Oxide Interface Traps

Livia Janice Widiapradja, Taewook Nam, Yeonsu Jeong, Hye Jin Jin, Yangjin Lee, Kwanpyo Kim, Sangyoon Lee, Hyungjun Kim, Heesun Bae, Seongil Im

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4 Citations (Scopus)


Among advanced devices with 2D semiconductors, charge injection memory field effect transistors (CIM FETs) may be one of the most important and practical ones. Reported CIM FETs utilize three layers (for tunneling, trapping, and bulk dielectric) in general, resulting in high switching voltages over 10 V. Here, nonvolatile CIM FETs are fabricated with MoS2 channel and hetero-stack bilayer oxide dielectrics adopting 5 nm-thin SiO2 and 25 nm-thick HfO2, where the charge traps are expected at the SiO2/HfO2 oxide interface. It is nicely observed from the device that a low pulse gate voltage below ±7 V is enough to obtain program and erase states, which would originate from the tunneling electrons trapped at the hetero-stack oxide interface. For comparison, other CIM FET devices are also fabricated but with tri-layer dielectric of 5 nm polystyrene-brush/5 nm HfO2/25 nm SiO2. Expectedly, the latter with tri-layer requires at least ±10 V for memory operations. The former with a hetero-stack oxide bilayer is now determined as an optimum device because of low operating voltages and less process complexity, and it is extended to a circuit application for a long-term memory switching of an organic light-emitting diode (OLED) pixel.

Original languageEnglish
Article number2100074
JournalAdvanced Electronic Materials
Issue number5
Publication statusPublished - 2021 May

Bibliographical note

Funding Information:
L.J.W. and T.N. contributed equally to this work. The authors acknowledge financial support from the National Research Foundation of Korea (SRC program: grant no. 2017R1A5A1014862, vdWMRC). H.B. acknowledges funding from the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (NRF‐2020R1I1A1A01052216). The authors gratefully acknowledge Hansol Chemical for the support of ALD precursors.

Publisher Copyright:
© 2021 Wiley-VCH GmbH

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials


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