Calculated based on number of publications stored in Pure and citations from Scopus
20002024

Research activity per year

Network

Seung H. Kang

  • Qualcomm Incorporated
  • Advanced Technology
  • Incheon National University

External person

Hanwool Jeong

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Samsung
  • Kwangwoon University

External person

Sung Mo Kang

  • University of Illinois at Urbana-Champaign
  • Pluris, Incorporation
  • University of California at Santa Cruz
  • University of California Office of the President
  • Electrical Engineering Department
  • School of Engineering
  • Baskin School of Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • University of Illinois at Santa-Cruz
  • University of Illinois at Santa-Cruz
  • Pluris
  • Department of Electrical Engineering, University of California
  • University of Illinois at Urbana-Champaign

External person

Jisu Kim

  • Yonsei University
  • Samsung

External person

Kyungho Ryu

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Jung Pill Kim

  • Qualcomm Incorporated
  • Advanced Technology

External person

Tae Woo Oh

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical
  • Haechitech
  • Samsung

External person

Taehui Na

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Incheon National University

External person

Dong Hoon Jung

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering Yonsei University 50 Yonsei-ro

External person

Byungkyu Song

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Samsung

External person

Younghwi Yang

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Juhyun Park

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Hynix Semiconductor Inc.
  • SK Corporation

External person

K. W. Kim

  • Brocade Communications Systems Inc.
  • Pluris, Incorporation
  • University of Illinois at Urbana-Champaign
  • SiPackets Inc.
  • Pluris
  • University of Illinois at Urbana-Champaign

External person

Kiryong Kim

  • Yonsei University
  • Samsung

External person

H. K. Park

  • Samsung
  • Qualcomm Incorporated
  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • DRAM Design

External person

Taejoong Song

  • S.LSI Division in Samsung Electronics
  • S.SLI Division at Samsung Electronics
  • S.SLI Division Samsung Electronics
  • Samsung
  • System Large-Scale Integration Division
  • S.SLI Division at Samsung Electronics
  • Yonsei University

External person

Sehee Lim

  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Dong Han Ko

  • Yonsei University

External person

S. C. Song

  • Qualcomm Incorporated
  • SEMATECH
  • Samsung

External person

Joseph Wang

  • Qualcomm Incorporated

External person

Keonhee Cho

  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Geoffrey Yeap

  • Qualcomm Incorporated
  • Motorola
  • DigitalDNA Laboratories

External person

Young Kyu Lee

  • Yonsei University

External person

Sanghun Jeon

  • Korea Advanced Institute of Science and Technology

External person

Jung Hyun Park

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Hong Keun Ahn

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Se Keon Kim

  • Yonsei University

External person

Sara Choi

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Samsung

External person

In Jun Jung

  • Yonsei University

External person

Sunghwan Joo

  • Yonsei University
  • Samsung

External person

Byoung Mo Moon

  • Yonsei University
  • Samsung

External person

Junghyeon Hwang

  • Korea Advanced Institute of Science and Technology

External person

S. H. Woo

  • Qualcomm Incorporated
  • Yonsei University
  • Samsung
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Ji Young Kim

  • Yonsei University
  • Samsung

External person

Young Jae An

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Tae Hyun Kim

  • Yeungnam University
  • Yonsei University
  • Samsung
  • Memory Division of Samsung Electronics

External person

S. M. Yoo

  • University of Illinois at Urbana-Champaign
  • Samsung
  • DRAM Design
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Dept. of Electr. Eng.
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

K. H. Baek

  • University of Illinois at Urbana-Champaign
  • Rockwell Scientific
  • Rockwell Science Center
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Teledyne Technologies
  • Rockwell Collins
  • University of Illinois at Urbana-Champaign

External person

Gi Seok Kim

  • Center for Sustainable Buildings
  • Yonsei University
  • Samsung

External person

Gyuhong Kim

  • S.SLI Division at Samsung Electronics
  • S.SLI Division Samsung Electronics
  • S.LSI Division in Samsung Electronics
  • Samsung
  • System Large-Scale Integration Division
  • S.SLI Division at Samsung Electronics
  • Samsung Advanced Institute of Technology

External person

Ji Sang Oh

  • Yonsei University

External person

Min Gu Kang

  • Department of Ceramic Engineering
  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Qualcomm Incorporated
  • Dept. of Ceramic Engineering
  • Dept. of Ceramic Eng.
  • Samsung
  • DRAM Design
  • School of Electrical and Electronic Engineering
  • Information Display Device Laboratory
  • Yonsei University Mirae Campus

External person

Jin Young Chun

  • Samsung
  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Kyomin Sohn

  • Samsung Memory DS
  • Samsung

External person

C. L. Liu

  • Pluris, Incorporation
  • University of Illinois at Urbana-Champaign
  • National Tsing Hua University
  • Department of Computer Science
  • Pluris

External person

Sumin Lee

  • Yonsei University

External person

Giuk Kim

  • Korea Advanced Institute of Science and Technology

External person

Yeongseok Jeong

  • Korea Advanced Institute of Science and Technology

External person

Junyoung Ko

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Sei Seung Yoon

  • Qualcomm Incorporated

External person

Hunbeom Shin

  • Korea Advanced Institute of Science and Technology

External person

Tae Hoon Choi

  • Samsung
  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical

External person

H. Kang

  • Yonsei University
  • Samsung
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Chulwoo Kim

  • University of Illinois at Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Junha Lee

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Taewon Kim

  • Semiconductor R and D Center at Samsung Electronics
  • Semiconductor R and D Center in Samsung Electronics
  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Semiconductor R and D Center at Samsung Electronics
  • Samsung
  • Semiconductor R and D Center at Samsung Electronics
  • Semiconductor R and D Center in Samsung Electronics

External person

Sangho Lee

  • Korea Advanced Institute of Science and Technology

External person

Suk Min Kim

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Hynix Semiconductor Inc.
  • SK Corporation

External person

Minjune Yeo

  • Yonsei University

External person

Moosung Kim

  • Samsung
  • Samsung Advanced Institute of Technology

External person

Won Lee

  • Samsung
  • System LSI Division

External person

Kyeongrim Baek

  • Yonsei University

External person

Kyoman Kang

  • Yonsei University
  • Samsung
  • School of Electrical and Electronic Engineering

External person

Unni Narayanan

  • University of Illinois at Urbana-Champaign
  • Intel

External person

Taewhan Kim

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering

External person

Tae Ho Kim

  • Korea Advanced Institute of Science and Technology
  • Samsung

External person

Soo Hwan Kim

  • University of California at Santa Cruz
  • Korea University

External person

Youngin Goh

  • Korea Advanced Institute of Science and Technology
  • Samsung

External person

Jeonghyeok You

  • Yonsei University

External person

Taeryeong Kim

  • Yonsei University

External person

Ge Yang

  • NVIDIA
  • University of California at Santa Cruz
  • Electrical Engineering Department
  • Department of Electrical Engineering, University of California

External person

Hyo Sig Won

  • S.SLI Division at Samsung Electronics
  • S.LSI Division in Samsung Electronics
  • Samsung
  • System Large-Scale Integration Division
  • S.SLI Division at Samsung Electronics
  • S.SLI Division Samsung Electronics

External person

Jongsoo Lee

  • Samsung
  • Yonsei University

External person

P. Saxena

  • Pluris, Incorporation
  • Intel
  • Pluris

External person

Minhyun Jung

  • Korea Advanced Institute of Science and Technology

External person

Kaushik Roy

  • Purdue University
  • School of Electrical and Computer Engineering
  • School of Electrical Engineering, Purdue University

External person

L. Ge

  • Qualcomm Incorporated

External person

Seokhee Cho

  • Yonsei University

External person

Rino Choi

  • Inha University
  • SEMATECH
  • School of Advanced Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering

External person

S. Simon Wong

  • Stanford University
  • School of Electrical Engineering
  • Stanford University

External person

Hyunwoo Nho

  • Stanford University
  • School of Electrical Engineering
  • Stanford University

External person

Suki Kim

  • Korea University

External person

Gaurav Kaushal

  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Frank Yang

  • Qualcomm Incorporated

External person

Minki Kim

  • Korea Advanced Institute of Science and Technology

External person

Youngdon Jung

  • Yonsei University

External person

Jun Ho An

  • Yonsei University
  • Samsung

External person

Chulhyun Park

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Center for Information Technology

External person

Minyoung Jo

  • Yonsei University

External person

Jung Han Kang

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology

External person

J. R. Choi

  • Samsung
  • System LSI Division

External person

Beomsang Yoo

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Myeong Eun Hwang

  • Purdue University
  • Intel

External person

Taehyong Eom

  • Korea Advanced Institute of Science and Technology

External person

B. M. Han

  • Qualcomm Incorporated

External person

Jee Hwan Song

  • Yonsei University

External person

Heekyung Choi

  • Yonsei University

External person

D. H. Lee

  • Samsung
  • System LSI Division

External person

Do Han Kim

  • Yonsei University

External person

Jiwan Jung

  • Yonsei University
  • Samsung
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Kwang Woo Lee

  • Yonsei University
  • Samsung

External person

M. H. Abu-Rahma

  • Qualcomm Incorporated

External person

Woojin Rim

  • Samsung
  • System Large-Scale Integration Division

External person

Taemin Choi

  • Yonsei University
  • Samsung

External person

Jongha Park

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Ki Beom Lee

  • Yonsei University

External person

J. W. Yang

  • Korea University
  • SEMATECH
  • Semiconductor Manufacturing Technology
  • Department of Electronics and Information Engineering

External person

Seungiae Yei

  • Yonsei University

External person

Ingeol Lee

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Samsung

External person

Boram Yi

  • Samsung

External person

S. K. Manhas

  • Indian Institute of Technology Roorkee
  • Electronics and Communication Engineering

External person

Chiming Show

  • T-RAM Semiconductor

External person

Siva Nageswar Rao

  • VFSTR University
  • Electronics and Communication Engineering Department
  • Electronics and Communication Engineering Department
  • Vignan's Foundation for Science, Technology & Research

External person

Hyun Jin Cho

  • T-RAM Semiconductor

External person

S. Dasgupta

  • Electronics and Communication Engineering
  • Indian Institute of Technology Roorkee

External person

Se Hyeok Oh

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • LG Corporation

External person

Won Joon Jo

  • Yonsei University

External person

Choongkeun Lee

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

S. M. Yo

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign

External person

K. Park

  • Hynix Semiconductor Inc.
  • SK Corporation

External person

Kyuman Kang

  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Rajesh Chopra

  • T-RAM Semiconductor

External person

Ken Young

  • T-RAM Semiconductor

External person

Hyunjun Kim

  • Yonsei University

External person

Bruce Bateman

  • T-RAM Semiconductor

External person

Sungho Park

  • Yonsei University
  • Department of Computer Science

External person

Junghyup Lee

  • Yonsei University

External person

Youngkyu Song

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

K. Subramanyam

  • VFSTR University
  • Electronics and Communication Engineering Department
  • Electronics and Communication Engineering Department
  • Vignan's Foundation for Science, Technology & Research

External person

Wonsuk Seo

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Dohyung Kim

  • SK Inc.
  • SK Corporation
  • Yonsei University

External person

Hoonhee Han

  • Hanyang University

External person

Taeyun Lee

  • Samsung
  • Yonsei University

External person

S. H. Kim

  • Yonsei University
  • Pusan National University
  • Gyeongsang National University
  • Gangneung-Wonju National University
  • University of Texas at Austin
  • Gangneung-Wonju National University
  • Samsung
  • Gangneung-Wonju National University
  • Gangneung-Wonju National University
  • Konkuk University
  • University of Ulsan
  • Ajou University
  • Department of Environmental Engineering
  • Department of Civil and Environmental Engineering
  • Department of Anatomy
  • Department of Electrical Engineering
  • Department of Mathematics
  • Department of Environmental Engineering
  • Department of Medicine
  • Department of Neurosurgery
  • Department of Medicine
  • Brain Korea 21 Project for Medical Science
  • System LSI Division
  • Department of Neurosurgery
  • Gangneung-Wonju National University
  • Gangneung-Wonju National University
  • Department of Electrical Engineering
  • Department of Pharmacology
  • Kyungpook National University
  • Gangneung-Wonju National University
  • ?Gangneung-Wonju National University
  • Department of Pharmacology

External person

Mingu Kang

  • University of California at San Diego

External person

Jeongyong Sim

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Jia Park

  • Yonsei University

External person

Lingwei Zhang

  • Korea Advanced Institute of Science and Technology

External person

Sung Geun Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Jinhyuk Kim

  • Yonsei University
  • School of Integrated Technology
  • Yonsei Institute of Convergence Technology and School of Integrated Technology
  • Seamless Transportation Lab (STL)
  • Telechips
  • Ltd.

External person

Young Seok Jung

  • Yonsei University

External person

Sunghwan Joo

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Farid Nemati

  • T-RAM Semiconductor

External person

Hyo Jung Jang

  • Yonsei University
  • Samsung

External person

Changhwan Choi

  • Hanyang University
  • Division of Materials Science and Eng.

External person

Suho Kim

  • Samsung

External person

Jaehyun Park

  • Yonsei University

External person

Jaeseok Park

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Electrical Engineering
  • Information Display Device Laboratory
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering

External person

Do Yoon Lim

  • Yonsei University

External person

Satish Maheshwaram

  • Indian Institute of Technology Roorkee
  • Electronics and Communication Engineering

External person

Radhika Ramya

  • Electronics and Communication Engineering Department
  • Vignan's Foundation for Science, Technology & Research

External person

Young Seok Park

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Information Telecommunication Lab. (B715)
  • Department of Electrical and Electronic Engineering

External person

Jae Yoon Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Kangwook Jo

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Byung Jin Cho

  • Korea Advanced Institute of Science and Technology
  • National University of Singapore
  • Department of Electrical Engineering
  • School of Electrical Engineering

External person

Sung Woo Chung

  • Korea University
  • Division of Computer and Communications Engineering
  • Computer and Information Technology
  • Samsung
  • University of Virginia
  • University of Virginia School of Engineering and Applied Science

External person

Ramesh Vaddi

  • Shiv Nadar University
  • Shiv Nadar University
  • Department of Electrical Engineering

External person

G. Vidya

  • Electronics and Communication Engineering Department
  • Vignan's Foundation for Science, Technology & Research

External person

Tae Woo Oh

  • Yonsei University

External person

Hohyun Chae

  • Yonsei University

External person

Rich Roy

  • T-RAM Semiconductor

External person

Sadulla Shaik

  • VFSTR University
  • Electronics and Communication Engineering Department
  • Electronics and Communication Engineering Department
  • Vignan's Foundation for Science, Technology & Research

External person

Hyuck Sang Yim

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • DRAM Design Group Hynix Inc

External person