Calculated based on number of publications stored in Pure and citations from Scopus
1993 …2025

Research activity per year

Network

Hee Jo Lee

  • Yonsei University
  • Daegu University
  • Sejong University
  • School of Electrical and Electronic Engineering
  • Graphene Research Institute
  • Department of Physics Education
  • Department of Electrical and Electronic Engineering
  • School of Mechanical Engineering
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology
  • Mechanical Engineering
  • Information Telecommunication Lab. (B715)
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

I. P. Hong

  • Kongju National University
  • Yonsei University
  • Department of Information and Communication Engineering
  • Rradio Science Engineering
  • Dept. of Radio Science Eng.
  • Electric Wave Engineering
  • School of Information Communication Engineering
  • Dept. of Information and Electricity Eng.
  • Department of Electrical and Electronic Engineering
  • Information and Communication Engineering
  • School of Information and Communication Engineering
  • Gongju Nat'l. Univ.
  • Kongu University

External person

Han Kyu Park

  • Yonsei University
  • LG Corporation
  • Center for Information Technology
  • MMC Gr. Multi-Media Research Laboratory
  • Department of Electrical and Electronic Engineering
  • Dept. of Electronics Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Electronic Engineering

External person

Cheol Mun

  • Korea National University of Transportation
  • Yonsei University
  • Chungju National University
  • Dept. of Electronic Communication Eng.
  • Dept. of Information and Communications Engineering
  • Dept. of Information and Communication Engineering
  • Department of Information and Communications Eng.
  • Information Display Device Laboratory
  • Department of Electronic Communication Engineering
  • Department of Electronic Engineering
  • Chungju National University

External person

Han Shin Jo

  • Hanbat National University
  • Yonsei University
  • University of Texas at Austin
  • Department of Electrical and Computer Engineering
  • Department of Electronic and Control Engineering
  • Information Telecommunication Lab. (B715)
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering
  • Division of Electrical and Electronics Engineering
  • Hanyang University

External person

Gi Ho Yun

  • Sungkyul University
  • Sungkyul University
  • Information and Communication Engineering
  • Dept. Information and Communication Engineering
  • Information and Communications Engineering
  • Dept. Information and Communication Engineering
  • Sungkyul University

External person

Seong Sik Myoung

  • Yonsei University
  • Georgia Institute of Technology
  • Georgia Electronic Design Center
  • Department of Electrical Engineering
  • Center for Information Technology
  • Electronic Design Center
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Georgia Institude of Technology
  • Department of Electrical and Electronic Engineering

External person

Young Pyo Hong

  • Yonsei University
  • University of California at San Diego
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Computer Engineering
  • Center for Information Technology
  • Department of Electrical Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Linda P B Katehi

  • University of Michigan, Ann Arbor
  • University of Illinois at Chicago
  • NASA Glenn Research Center
  • Emag Technologies
  • IEEE
  • Georgia Institute of Technology
  • Radiation Laboratory
  • Jordan University of Science and Technology
  • Purdue University
  • Montana State University
  • University of Illinois at Urbana-Champaign
  • Electrical Engineering and Computer Science Department
  • Real-Time Computing Laboratory
  • College of Engineering
  • Solid State Electronics Laboratory
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering Department
  • Dept. of Elec. and Comp. Engineering
  • School of Engineering
  • School of Engineering

External person

Hyun Kim

  • Yonsei University
  • ISR R and D Lab.
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Electronic Engineering
  • Information Telecommunication Lab. (B715)
  • LIG Nex1 Co., Ltd.

External person

Jung Min Kim

  • Yonsei University
  • Yonsei University Mirae Campus
  • Kyungpook National University
  • Sungkyunkwan University
  • Cornell University
  • Department of Electrical and Electronic Engineering
  • Department of Otorhinolaryngology
  • Institute for Cancer Research
  • Department of Microbiology
  • Department of Medicine
  • Department of Electrical Engineering
  • School of Electrical and Electronic Engineering
  • Center for Information Technology
  • Division of Cardiology
  • Department of Materials Science and Engineering
  • Department of Microbiology
  • School of Electrical and Electronic Engineering
  • Samsung Medical Center, Sungkyunkwan University

External person

Byung Hyun Kim

  • Yonsei University
  • Advanced Computational Electromagnetics Laboratory
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering
  • Yonsei, University
  • Ranix, Inc.

External person

Il Young Oh

  • Department of Electrical and Electronic Engineering
  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Dongyang Mirae University
  • School of Electrical Engineering
  • Center for Information Technology
  • Dongyang Mirae University
  • Dongyang Mirae University

External person

Il Suek Koh

  • Inha University
  • Graduate School of Information Technology and Telecommunications
  • Graduate School of Information Technology and Telecommunications
  • Graduate School of Information Technology and Telecommunication
  • Department of Electronic Engineering
  • Department of Electronic Engineering
  • Department of Electonic Engineering
  • Depertment of Electronic Engineering
  • Electronic Engineering
  • Inha Unvierstiy

External person

Hee Do Kang

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Information Telecommunication Lab. (B715)
  • Information Display Device Laboratory

External person

Yi Ru Jeong

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Computer Engineering
  • University of Texas at Austin

External person

K. W. Lee

  • Yonsei University
  • LIG Nex1 Co., Ltd.
  • LIG Nex1 Co.
  • LIG Nex1 Co.

External person

Sang Gyu Kim

  • Yonsei University
  • LG Corporation
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Information Telecommunication Lab. (B715)

External person

Yeong Hoon Noh

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Duke University

External person

Y. J. An

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering

External person

Dong Hoon Choi

  • Department of Electrical and Electronic Engineering
  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Sang Hyuk Wi

  • Yonsei University
  • Samsung Advanced Institute of Technology
  • Dept. of Electrical Eng.
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronics Engineering
  • Samsung

External person

Dongsu Kim

  • Korea Electronics Technology Institute
  • Samsung

External person

Euibum Lee

  • Yonsei University

External person

Ho Seong Lee

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Hyun Goo Yoon

  • Myongji College
  • Yonsei University
  • Department of Computer and Electronic Engineering
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering

External person

Byung Jun Jang

  • Kookmin University
  • Koohnin University
  • Department Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electronic Engineering
  • School of Electronics Engineering

External person

Jin Kwan Park

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Yunseog Hong

  • Yonsei University
  • Samsung Thales
  • Samsung Thales
  • Samsung Advanced Institute of Technology
  • Radar and PGM Center
  • School of Electrical and Electronic Engineering
  • Radar and PGM Center
  • Department of Electrical and Electronic Engineering
  • Radar and PGM Center
  • Department of Radar R and D Center
  • Department of Radar
  • Hanwha
  • Radar and PGM Center
  • Yongin R and D Center
  • Radar and PGM Center

External person

Yuna Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Tae Sik Nam

  • Yonsei University
  • LSIS Co. Ltd
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Sang No Lee

  • Yonsei University
  • Samsung
  • Center for Information Technology
  • Department of Electrical Engineering
  • Department of Electrical and Electronic Engineering
  • School of Mechanical Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Jin Kyoung Du

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology

External person

Wootae Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronics Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology
  • Department of Electrical Engineering

External person

Tae Wan Koo

  • Yonsei University
  • Korea Electronics Technology Institute
  • Department of Electrical and Electronic Engineering
  • System Packaging Center
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Information Display Device Laboratory

External person

Jong Hwa Kwon

  • Electronics and Telecommunications Research Institute
  • Department of EMF Research Team
  • Radio Technology Research Department
  • Radio Technology Group
  • Broadcasting and Telecommunication Convergence Research Laboratory
  • Radio and Broadcasting Research Division
  • EME Research Team

External person

Hyang Hee Choi

  • Yonsei University
  • Institute of Nanoscience and Nanotechnology
  • Department of Chemical and Biomolecular Engineering
  • Engineering Research Institute
  • Department of Materials Science and Engineering
  • Nano Medical National Core Research Center
  • Nanomedical National Core Research Center
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Il Kwon Kim

  • IEEE
  • Yonsei University
  • Georgia Institute of Technology
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology

External person

Jun Chul Kim

  • Korea Electronics Technology Institute
  • Samsung
  • System Packaging Center
  • Electro Material and Device Lab.
  • ICT Device Packaging Research Center
  • Electronic Materials and Device Research Center
  • Department of Electrical Packaging Research Center

External person

Jae Woo Lim

  • MIC
  • Ministry of Information and Communication Republic of Korea
  • Ministry of Information
  • KCC
  • Radio Research Laboratory
  • RRL(Radio Research Laboratory)
  • Radio Research Laboratory
  • Communication Radio Research Laboratory
  • Radio Research Laboratory

External person

Tae Hyung Kim

  • Sungkyunkwan University
  • Seoul National University
  • Yonsei University
  • Samsung

External person

Sangin Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Hyeong Rae Im

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Chan Sun Park

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • School of Electrtcal and Electronic Engineering

External person

Chorom Jang

  • Department of Electrical and Electronic Engineering
  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Yongjun Hong

  • Korean Agency for Defense Development
  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Chan Sei Yoo

  • Korea Electronics Technology Institute
  • Samsung
  • Electronic Materials and Device Research Center
  • System Packaging Center
  • Electro Material and Device Lab.

External person

Tae Lim Song

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Information Display Device Laboratory
  • School of Electrical and Electronic Engineering

External person

Tong Ho Chung

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • R and D Innovation Center
  • Information Display Device Laboratory

External person

Se Young Hyun

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Information Display Device Laboratory
  • Department of Electrical and Electronic Engineering

External person

Joy Laskar

  • Yonsei University
  • Ashahi Glass Company
  • Georgia Institute of Technology
  • Georgia Electronic Design Center
  • Georgia Institute of Techonology
  • Electronic Design Center
  • Georgia Institude of Technology
  • IEEE

External person

Hyunjae Lee

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Yonsei, University
  • School of Electrical and Electronic Engineering
  • Hanwha

External person

Inhwan Kim

  • Yonsei University

External person

Woobin Kim

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Kyuhong Sim

  • LIG Nex1
  • Electronic Warfare RandD Lab
  • LIG Nex1 Co. Ltd.
  • LIG Nex1 Co., Ltd.

External person

Inkyun Jung

  • Yonsei University
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Manos M. Tentzeris

  • IEEE
  • Georgia Institute of Technology
  • Georgia Tech National Science Foundation (NSF)-Packaging Research Center
  • Georgia Electronic Design Center (GEDC) of the State of Georgia
  • Technical Chamber of Greece
  • RF Technical Committee (TC16
  • Georgia Institute of Techonology

External person

Nihad Dib

  • University of Michigan, Ann Arbor
  • IEEE
  • Radiation Laboratory
  • Jordan University of Science and Technology
  • Real-Time Computing Laboratory
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering Department
  • Solid State Electronics Laboratory
  • Electrical Engineering and Computer Science Department

External person

Hyunsoo Lee

  • Inha University
  • Department of Electronic Engineering
  • Korean Agency for Defense Development

External person

Hoon Gee Yang

  • Kwang Woon University
  • Kwangwoon University
  • Department of Radio Science and Engineering
  • Department of Wireless Communications Engineering

External person

Heejin Joung

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Information Display Device Laboratory
  • Department of Electrical and Electronic Engineering
  • Information Display Device Laboratory

External person

Hyunseok Lee

  • Yonsei University
  • Korea Institute of Science and Technology

External person

Sang Il Kwak

  • Electronics and Telecommunications Research Institute
  • Yonsei University
  • Radio Technology Research Department
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology
  • Radio Technology Research Departmant
  • EM Environment Research Team
  • Radio Technology Group
  • Broadcasting and Telecommunication Convergence Research Laboratory

External person

Kun Wook Kim

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical Engineering
  • Department of Electrical and Electronic Engineering

External person

Jun Chul Park

  • Korea Electronics Technology Institute
  • Yonsei University
  • Electronic Materials and Device Research Center
  • Department of Electrical and Electronic Engineering
  • System Packaging Center
  • Information Telecommunication Lab. (B715)
  • Department of Electrical and Electronic Engineering

External person

Woo Sung Lee

  • Korea Institute of Industrial Technology
  • Korea Electronics Technology Institute
  • Yonsei University

External person

Myoung Won Lee

  • Yonsei University
  • Telecommunication Network Business Samsung Electronics
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Center for Information Technology

External person

Woong Yong Lee

  • Dept. Material RandD and Production
  • Dept. Material RandD and Production Amotech
  • Material R&D and Production Department
  • Amotech Company Ltd.

External person

J. Ha

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Korean Agency for Defense Development
  • Chungnam National University

External person

Dong Hyun Kim

  • Actipass Company Ltd.
  • Yonsei University

External person

Dong Uk Sim

  • Electronics and Telecommunications Research Institute
  • Radio Technology Research Department
  • Radio Technology Group
  • Broadcasting and Telecommunication Convergence Research Laboratory

External person

Young Soo Kim

  • Kyung Hee University
  • Department of Radio Engineering
  • Department of Electronic and Radio Engineering
  • Department of Radio Communications Engineering
  • College of Electronics and Information

External person

Seju Park

  • Department of Electrical and Electronic Engineering
  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Joon Ik Lee

  • Yonsei University
  • School of Mechanical Engineering
  • Dept. of Mechanical Eng.
  • School of Mechanical Engineering

External person

Sung Hoon Choa

  • Samsung Advanced Institute of Technology
  • Seoul National University of Science and Technology (SNUST)
  • Samsung
  • Yonsei University
  • MEMS Lab.
  • Graduate School of NID Fusion Technology
  • HDD Storage Division
  • Department of Mechanical Engineering

External person

Yong Bae Park

  • Ajou University
  • Ajoo University Medical Center
  • Department of Electrical and Computer Engineering
  • Electronic Engineering
  • Electronic Engineering
  • School of Electrical and Computer Eng.
  • Department of Electronic Engineering
  • School of Electrical and Computer Engineering

External person

Insang Song

  • Samsung Advanced Institute of Technology
  • Samsung
  • Chungnam National University
  • Department of Surgery
  • MEMS Lab.

External person

Soon Chul Jeong

  • Actipass Company Ltd.
  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Woo Young Song

  • Cheongju University
  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Dept. of Electronics Eng.
  • Department of Electronic Engineering
  • Dept. of Blectronics Eng
  • College of Sci. and Eng.

External person

Haneul Woo

  • Yonsei University

External person

Soon Young Eom

  • Electronics and Telecommunications Research Institute
  • Antenna Research Team of the Broadcasting and Telecommunications
  • Radio and Broadcasting Tech. Laboratory

External person

J. Gao

  • Southeast University, Nanjing
  • Carleton University

External person

Yong Dae Kim

  • Yonsei University
  • IEEE
  • Yeungnam University

External person

Eunseok Song

  • Yonsei University
  • Samsung

External person

Se Yun Kim

  • Samsung Advanced Institute of Technology
  • Korea Institute of Science and Technology
  • Samsung
  • Materials Research Center
  • Inorganic Materials Lab
  • Inorganic Materials Lab
  • Electronic Materials Laboratory
  • Samsung Advanced Institute of Technology (SAIT)
  • Materials R and D Center
  • Center for Imaging Media Research

External person

Yeong Chul Chung

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

E. J. Powers

  • University of Texas at Austin
  • Texas Atomic Energy Research Foundation
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Jae Hyoung Cho

  • Yonsei University
  • Korea Institute of Science and Technology
  • Department of Electrical and Electronic Engineering
  • Center for Imaging Media Research
  • School of Electrical and Electronic Engineering
  • Digital Image Media Lab.
  • Imaging Media Research Center

External person

Myeong Gweon Gu

  • MEMS Solutions, Inc.
  • MEMS Solution Inc.
  • MEMS Solutions Inc.

External person

George E. Ponchak

  • NASA Glenn Research Center
  • IEEE
  • Electron Device Technology Branch

External person

Jiseong Kim

  • Samsung
  • Computer Division

External person

Karem A. Sakallah

  • University of Michigan, Ann Arbor
  • IEEE
  • Real-Time Computing Laboratory

External person

Do Yun Kim

  • Yonsei University
  • Dept. of Electrical Eng.
  • Information Telecommunication Lab. (B715)
  • Center for Information Technology
  • Division of Electrical and Electronics Engineering
  • Department of Electrical Engineering

External person

Jong Min Yook

  • Korea Electronics Technology Institute
  • System Packaging Center
  • ICT Device Packaging Research Center
  • Department of Electrical Packaging Research Center
  • Yonsei University

External person

Jin Kyu Han

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Center for Information Technology
  • Communication R and D Center

External person

Jun Ki Hong

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Woo Ghee Chung

  • Yonsei University
  • Chungkang College of Cultural Industries
  • Department of Electrical and Electronic Engineering
  • Department of Mobile Communications
  • Department of Electrical and Electronic Engineering
  • Center for Information Technology

External person

John Papapolymerou

  • IEEE
  • Georgia Institute of Technology
  • U.S. National Committee of URSI

External person

Tok Son Choe

  • Yonsei University
  • Korean Agency for Defense Development
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Dept. of Electrical Eng.
  • Department of Electrical and Electronic Engineering

External person

Joo Young Choi

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Doosoo Kim

  • Korean Agency for Defense Development

External person

Stephane Pinel

  • Georgia Institute of Technology

External person

Jikwon Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Kukhyun Sunwoo

  • Samsung
  • Samsung Advanced Institute of Technology
  • Communication and Network Laboratory
  • MEMS Lab.

External person

Jun Hwa Oh

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical and Electronics Engineering

External person

Tim Schreyer

  • University of Michigan, Ann Arbor
  • Intel

External person

Hyun Sung Tae

  • Korean Agency for Defense Development

External person

Kyungho Yoo

  • Samsung
  • DMC RandD Center
  • Digital Media and Communications R and D Center

External person

Myung Gun Lee

  • Korean Agency for Defense Development

External person

June Moon

  • Samsung
  • PhilTech Co., Ltd
  • Telecommunication R and D Center

External person

Seung Seok Oh

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering

External person

Sewoong Kwon

  • LIG Nex1 Corporation
  • Yonsei University
  • ISR RandD Laboratory LIG Nex1
  • Samsung
  • Center for Information Technology
  • Department of Electrical Engineering
  • Department of Electrical and Electronic Engineering
  • Radio Research Laboratory
  • Department of Electrical and Electronic Engineering
  • LIG Nex1 Co., Ltd.

External person

Sung Geon Kim

  • Yonsei University

External person

Duck Hwan Kim

  • Samsung Advanced Institute of Technology
  • Microelectromechanical Systems (MEMS) Laboratory
  • MEMS Lab.
  • Samsung

External person

Sung Woo Kim

  • LG Corporation
  • I-Aurora
  • Advanced Research Institute
  • Future IT R and D Laboratory
  • Yonsei University

External person

Gihun Bae

  • Korean Agency for Defense Development
  • Chungnam National University

External person

Tae Gyu Kang

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Jongwon Lee

  • Korean Agency for Defense Development

External person

Tawfik Arabi

  • University of Michigan, Ann Arbor
  • Intel
  • Architecture Development Laboratory

External person

Youn Hyun Park

  • Ministry of Information and Communication Republic of Korea
  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Rainee N. Simons

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Yoon Jae Kim

  • Korean Agency for Defense Development
  • Gency for Defense Development
  • Development

External person

Eray Yasan

  • University of Michigan, Ann Arbor
  • Solid State Electronics Laboratory
  • Real-Time Computing Laboratory

External person

Jin Soo Choi

  • Korean Agency for Defense Development
  • 4th Institute

External person

Kyutae Lim

  • Georgia Institute of Technology
  • Georgia Electronic Design Center
  • Georgia Institute of Techonology
  • Electronic Design Center
  • Georgia Institude of Technology

External person

Young Woo Nam

  • Gyeongsang National University
  • Korea Advanced Institute of Science and Technology

External person

Lawrence E. Larson

  • University of California at San Diego
  • Department of Electrical and Computer Engineering

External person

Jinwoo Yim

  • Korean Agency for Defense Development
  • Chungnam National University

External person

Hwang Yoon Shim

  • Samsung
  • Yonsei University
  • Computer Division
  • Department of Electrical and Electronic Engineering

External person

Jin Hwe Kweon

  • Gyeongsang National University

External person

Yong Joo Lee

  • Yonsei University

External person

Jong In Ryu

  • Korea Electronics Technology Institute
  • System Packaging Center

External person

Jeong Il Kim

  • Purdue University
  • School of Electrical and Computer Engineering
  • Yonsei University
  • Electronics and Telecommunications Research Institute
  • Radio Technology Research Department

External person

Jung Joon Lee

  • Yonsei University
  • Department of Chemical and Biomolecular Engineering

External person

Youngjae Ryu

  • Yonsei University

External person

Won Ho Choi

  • Korean Air
  • RD Center
  • Korean Air

External person

Wookhyun Ahn

  • Yonsei University

External person

Shin Young Lee

  • Samsung
  • Digital Media and Communications R and D Center
  • DMC RandD Center

External person

Jeongnam Cheon

  • Samsung
  • Digital Media and Communications R and D Center
  • DMC RandD Center

External person

Changseok Cho

  • Yonsei University

External person

Ji Hyun Jung

  • Samsung Advanced Institute of Technology
  • Korea Institute of Science and Technology
  • Center for Imaging Media Research
  • Hanwha

External person

Wook Bae Kim

  • Tech University of Korea
  • Yonsei University
  • Dept. of Mechanical Eng.
  • School of Mechanical Design Engineering
  • Institute of Automotive Technology
  • School of Mechanical Engineering
  • School of Mechanical Engineering
  • Department of Mechanical Engineering
  • Korea Polytechnic University

External person

Jae Woo Park

  • Korean Agency for Defense Development
  • Seoul National University
  • Samsung
  • Knowledge ON Semiconductor Inc.
  • School of Chemical and Biological Engineering
  • LCD RD Center

External person

Tae Kyun Kim

  • PMT (Protec Mems Technology) Inc.
  • Yonsei University
  • Protec Mems Technology Inc.

External person

Sangheon Lee

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Jangjae Lee

  • Chungnam National University
  • Hyundai Mobis
  • Hyundai Motor Group

External person

B. S. Kwon

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Jeong Kyu Kim

  • Korean Agency for Defense Development

External person

Il Kyoo Lee

  • Kongju National University
  • Department of Information and Communication Engineering

External person

R. F. Drayton

  • University of Illinois at Chicago
  • University of Minnesota Twin Cities
  • Electrical and Computer Engineering Department

External person

Steve Park

  • Stanford University
  • Korea Advanced Institute of Science and Technology
  • Aldaver Inc

External person

Shin Jae You

  • Chungnam National University
  • Hyundai Mobis
  • Hyundai Motor Group

External person

Sehwa Yoon

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Peter M. Asbeck

  • University of California at San Diego
  • Department of Electrical and Computer Engineering

External person

Xiuping Li

  • Yonsei University
  • Beijing University of Posts and Telecommunications

External person

Jihoon Kim

  • Korea Institute of Ceramic Engineering And Technology
  • Kongju National University
  • Nano-IT Convergence Center
  • Future Convergence Ceramic Division
  • Division of Advanced Materials Engineering
  • Yonsei University
  • Dept. of Mechanical Eng.

External person

Hyung Do Choi

  • Electronics and Telecommunications Research Institute
  • Radio Technology Group
  • Radio Technology Research Department
  • Radio and Broadcasting Research Division
  • EME Research Team

External person

Kyeongyong Cho

  • Yonsei University

External person

Hong Ryeol Song

  • Samjin Elex Co. Ltd.
  • Samjin Elex Co.Ltd

External person

Jun Chang Yang

  • Korea Advanced Institute of Science and Technology

External person

Bong Hyuk Park

  • Electronics and Telecommunications Research Institute
  • Department of B4G Mobile Communications Research

External person

Kuk Jin Chun

  • Seoul National University
  • School of Electrical Engineering

External person

Jong Soo Kim

  • Yonsei University
  • Department of Electrical Engineering

External person

Cheong Min Lee

  • Yonsei University

External person

Jae Yeong Park

  • Yonsei University
  • LG Corporation

External person

Donald F. Kimball

  • California Institute for Telecommunications and Information Technology
  • University of California at San Diego

External person

Yu Ichi Hayashi

  • Tohoku Gakuin University
  • Nara Institute of Science and Technology

External person

Gi Won Jeong

  • Gyeongsang National University

External person

Jung Hyun Lee

  • Yonsei University
  • School of Mechanical Engineering
  • Nanomedical National Core Research Center
  • National Core Research Center for Nanomedical Technology
  • Nano Medical National Core Research Center
  • Department of Mechanical Engineering

External person

Mun Ho Choi

  • Actipass Company Ltd.

External person

Matt Morton

  • IEEE
  • Georgia Institute of Technology

External person

Xiuping Li

  • Yonsei University

External person

Nickolas Kingsley

  • IEEE
  • Georgia Institute of Technology

External person

Young Jun Hong

  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology

External person

Do Youn Kim

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering

External person

Juyeong Nam

  • Yonsei University

External person

Sung Ryul Kim

  • Korea Electronics Technology Institute
  • Soongsil University
  • System Packaging Center
  • School of Electrical Engineering

External person

Tae Hoon Yoo

  • Yonsei University
  • Dongyang Mirae Univ.
  • Dept. of Information and Communication Engineering
  • Center for Information Technology
  • Department of Information and Communication Engineering
  • Dongyang Mirae University
  • Dongyang Mirae University

External person

V. Chandramouli

  • University of Michigan, Ann Arbor
  • IEEE
  • Real-Time Computing Laboratory

External person

Jae Hyung Park

  • Yonsei University
  • Center for Information Technology

External person

S. Cheon

  • Korea Advanced Institute of Science and Technology
  • ON Semiconductor Corporation
  • Korean Agency for Defense Development

External person

Bong Gyu Kang

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering

External person

Sunghui Jo

  • Yonsei University

External person

Sung Jin An

  • Department of Electrical and Electronic Engineering
  • Korea Electronics Technology Institute
  • Yonsei University
  • System Packaging Center
  • School of Electrical and Electronic Engineering

External person

Yong Sik Shin

  • Infacyokowo Co. Ltd

External person

Byeong Su Kwak

  • Gyeongsang National University

External person

Minsoo Park

  • Korea Electronics Technology Institute
  • Yonsei University

External person

Soo Min Lee

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Eung Jo Kim

  • Yonsei University
  • ADD-Agency for Defense Development
  • Department of Electrical and Electronic Engineering
  • Korean Agency for Defense Development

External person

Dimitris Peroulis

  • Purdue University
  • School of Electrical and Computer Engineering
  • School of Engineering

External person

S. J. Yoon

  • Gwangju Institute of Science and Technology
  • Yonsei University

External person

In Gon Lee

  • Kongju National University
  • Department of Information and Communication Engineering
  • Hanwha

External person

Chilsung Jung

  • Korean Agency for Defense Development
  • Yonsei University

External person

S. H. Jeong

  • Department of Electrical and Electronic Engineering
  • Yonsei University
  • Center for Information Technology

External person

Sergio Raima Pacheco

  • University of Michigan, Ann Arbor
  • University of Illinois at Chicago

External person

Jin Sang Jang

  • Korean Agency for Defense Development

External person

Jong Hyun Lee

  • LIG Nex1 Co.
  • LIG Nex1 Co. Ltd.
  • EM R and D Center
  • EM R and D Center
  • LIG Nex1 Co., Ltd.

External person

Hyun Jin Lee

  • Yonsei University
  • Center for Information Technology

External person

Eunho Kim

  • Institute of Nano and Advanced Materials Engineering
  • Sejong University

External person

Jongwan Jung

  • Sejong University
  • Graphene Research Institute
  • Institute of Nano and Advanced Materials Engineering
  • Graphene Research Institute

External person

ChanYoung Hong

  • Yonsei University
  • Samsung
  • Department of Electrical Engineering
  • Dept. of Electrical Eng.

External person

Sung Woo Kim

  • Yonsei University
  • I-Aurora

External person

Yeong Chul Cheong

  • Defense Agency for Technology and Quality Assurance

External person

Seung Ki Pang

  • Kyungmin College
  • Kyungmin University
  • Dept. Architecture
  • Kyungmin University
  • Department of Architecture

External person

Yoon Ki Cho

  • Yonsei University
  • Information Display Device Laboratory
  • Department of Electrical and Electronic Engineering

External person

Joo Yong Kim

  • PMT (Protec Mems Technology) Inc.
  • Protec Mems Technology Inc.

External person

Donghoon Chun

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Seung Bum Hong

  • LG Corporation
  • Advanced Research Institute

External person

Tae Hoon Yoo

  • Dongyang Mirae University
  • Dongyang Mirae University

External person

Jeen Sang Jang

  • Korean Agency for Defense Development

External person

Jeung Uk Ha

  • LG Corporation
  • Yonsei University
  • MC RandD Center
  • Department of Mobile Communication CT
  • Center for Information Technology

External person

Jae Ick Choi

  • Electronics and Telecommunications Research Institute
  • Radio Technology Group
  • Radio and Broadcasting Research Division
  • EME Research Team

External person

Kurt A. Shalkhauser

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

J. S. Kim

  • Inha University
  • Yonsei University
  • LG Corporation
  • Center for Information Technology

External person

Sung Jun Park

  • Yonsei University

External person

Young Ho Lee

  • Yonsei University
  • Department of Electrical Engineering

External person

Dae Gi Yoon

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Sunghyun Yang

  • Kwangwoon University
  • Radio Frequency Integrated Circuits Lab

External person

E. Koh

  • Department of Mobile Communication CT
  • LG Corporation

External person

Yong Bin Sun

  • Kyonggi University
  • Graduate School of Industrial and Information Technology
  • Department of Materials Engineering

External person

Joon Soo Lim

  • Yonsei University
  • Department of Mechanical Engineering

External person

Joohwan Lee

  • Yonsei University
  • Samsung Inc.
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Test Department Division
  • Samsung
  • Samsung Advanced Institute of Technology

External person

Gwang Hoon Lee

  • Korea Electronics Technology Institute
  • Samsung
  • Electro Material and Device Lab.

External person

Ji Hyuk Kim

  • Seoul National University
  • School of Electrical Engineering

External person

Je In Yu

  • Korea Electronics Technology Institute
  • Yonsei University

External person

Soonik Jeon

  • Electronics and Telecommunications Research Institute
  • Yonsei University
  • School of Integrated Technology

External person

Taejoo Oh

  • Yonsei University

External person

Junyoung Byun

  • School of Electrical Engineering
  • Korea Advanced Institute of Science and Technology

External person

Bongsoon Kang

  • Dong-A University
  • Department of Electronic and Computer Engineering

External person

Heung Cheol You

  • Korean Agency for Defense Development
  • Chungnam National University

External person

Seogoo Lee

  • Yonsei University
  • Samsung

External person

Byoung Seong Park

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering

External person

Y. P. Zhang

  • Nanyang Technological University
  • Centre for Signal Processing
  • School of Electrical and Electronic Engineering

External person

Injoong Chang

  • Yonsei University
  • Department of Mechanical Engineering

External person

Kunsoo Shin

  • Samsung Advanced Institute of Technology
  • Samsung
  • Policy Planning Agency

External person

Donghoon Chen

  • NASA Glenn Research Center

External person

Youn Jae Kim

  • Korean Agency for Defense Development

External person

Yong Ho Cho

  • PMT (Protec Mems Technology) Inc.
  • Protec Mems Technology Inc.

External person

J. H. Kim

  • Yonsei University
  • Center for Information Technology

External person

Seung Hwan Lee

  • Yonsei University
  • Department of Chemical and Biomolecular Engineering
  • Department of Cardiology
  • Yonsei University Mirae Campus
  • Institute of Genomic Cohort
  • Division of Cardiology, Internal Medicine
  • Department of Internal Medicine
  • School of Mechanical Engineering
  • Ilsan Paik Hospital
  • Inje University

External person

Seong Keun Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering

External person

Gun Hee Lee

  • Korea Advanced Institute of Science and Technology

External person

Jung Mi Lee

  • Yonsei University
  • Center for Information Technology

External person

Wonshil Kang

  • Korea Electronics Technology Institute
  • Electronic Materials and Device Research Center
  • System Packaging Center

External person

Xiaowen Xu

  • Beijing Institute of Technology
  • Department of Electronic Engineering
  • Department of Electronic Engineering

External person

Won Chul Lee

  • Korea Electronics Technology Institute
  • Yonsei University
  • School of Electrical and Electronic Engineering
  • System Packaging Center

External person

Sangkil Kim

  • Pusan National University

External person

Kwansoo Yun

  • Inkjet Business Group
  • Samsung

External person

Se Young Kwon

  • Korea Advanced Institute of Science and Technology

External person

Hyeonji Kim

  • Korea Advanced Institute of Science and Technology

External person

Y. S. Shin

  • Yonsei University
  • Center for Information Technology

External person

Dae Do Yang

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Manshik Cho

  • Yonsei University
  • Center for Information Technology

External person

Seo Shanghoon

  • Samsung
  • EMD Center

External person

Daehee Park

  • Korea Electronics Technology Institute

External person

Hongsik Keum

  • Korea Radio Promotion Association
  • Electromagnetic Wave Technology Institute(EMTI)

External person

Hyunwook Moon

  • Yonsei University
  • ISR R and D Center
  • Department of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering
  • School of Electrical and Engineering
  • Center for Information Technology

External person

Bum Kook Lee

  • LG Corporation
  • MC RandD Center

External person

In Sub Kim

  • Infacyokowo Co. Ltd

External person

Sergio A. Pignari

  • Polytechnic University of Milan

External person

Yong Seung Kim

  • Graphene Research Institute
  • Sejong University

External person

Jingjiang Wang

  • University of South Carolina
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Mechanical Engineering
  • Department of Electrical Engineering

External person

Jeong Seok Lee

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Nathan Jeong

  • University of Alabama

External person

Chang Hoon Jeon

  • Yonsei University
  • Department of Electrical Engineering

External person

Choi Look Law

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.

External person

Hee Sauk Jhon

  • Yonsei University

External person

Ki Seok An

  • Korea Research Institute of Chemical Technology
  • Thin Film Materials Research Group

External person

Gyeongyeong Lee

  • Kongju National University

External person

Yeong Min Lee

  • Korea Radio Promotion Association
  • Electromagnetic Wave Technology Institute(EMTI)

External person

Tae Woong Yoon

  • Korea Electronics Technology Institute
  • Yonsei University
  • ICT Device Packaging Research Center
  • School of Electrical and Electronic Engineering

External person

Chun Ying Dong

  • Yonsei University
  • School of Mechanical Engineering

External person

M. Kurk

  • Electrical Engineering and Computer Science Department
  • University of Michigan, Ann Arbor

External person

Moon Hyun Chung

  • Yonsei University
  • Department of Chemical and Biomolecular Engineering
  • Korea Institute of Energy Research

External person

Young Choul Lim

  • Korea Radio Promotion Association
  • Electromagnetic Wave Technology Institute(EMTI)

External person

Sam Park

  • Yonsei University
  • Institute of Physics and Applied Physics
  • Hallym University

External person

Ramanan Bairavasubramanian

  • IEEE
  • Georgia Institute of Technology

External person

Sang Kyu Kim

  • Yonsei University
  • Center for Information Technology

External person

Nam Kee Kang

  • Korea Electronics Technology Institute
  • Electronic Materials and Device Research Center

External person

M. Q. Lee

  • Department of Electronic
  • University of Seoul

External person

Byong Gyo Lee

  • Kyung Hee University

External person

Jae Chon Park

  • Inha University
  • Graduate School of Information Technology and Telecommunication

External person

Wontaek Lee

  • Yonsei University

External person

Hyun H. Park

  • Corporate Technology Operations
  • Samsung

External person

Wooseok Song

  • Korea Research Institute of Chemical Technology
  • Thin Film Materials Research Group
  • Sungkyunkwan University

External person

Dongjoo Sim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

J. H. Moon

  • PhilTech Co., Ltd

External person

Seung Joo Lee

  • Samsung
  • Computer Division

External person

Michael Krumpholz

  • Radiation Laboratory
  • Jordan University of Science and Technology
  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering Department
  • Real-Time Computing Laboratory

External person

Chang Han Jun

  • Korea Radio Promotion Association
  • EMC Center

External person

Joo Yong Sim

  • Electronics and Telecommunications Research Institute

External person

S. S. Moon

  • Seoul National University

External person

Jong Humn Baek

  • Dae Duck Electronics
  • Daeduck Electronics Co. Ltd.

External person

Q. X. Jia

  • Los Alamos National Laboratory
  • Superconductivity Technology Center

External person

Jae Young Choi

  • Samsung Advanced Institute of Technology
  • Samsung
  • Display Laboratory
  • Korea Basic Science Institute
  • Samsung Advanced Institute of Technology (SAIT)
  • Yonsei University
  • Department of Materials Science and Engineering
  • Sungkyunkwan University
  • Kumoh National Institute of Technology
  • Korea Institute of Science and Technology

External person

Uh Hyeon Lee

  • PMT (Protec Mems Technology) Inc.

External person

Myeongha Hwang

  • Pusan National University

External person

Kun Woo Park

  • Hynix Semiconductor Inc.
  • Signal Integrity Part. Division of Memory RandD
  • Inc.
  • NAND-flash Research and Development Division
  • SK Corporation

External person

D. U. Shim

  • Electronics and Telecommunications Research Institute

External person

Seok Lee

  • Korea Institute of Science and Technology

External person

Jong Min Kim

  • Samsung
  • Samsung Advanced Institute of Technology
  • Konkuk University
  • Display Laboratory
  • Display Device and Processing Lab.
  • Frontier Research Lab.
  • Display Device and Material Lab.
  • Display Device Laboratory
  • Department of Electronic Engineering
  • Department of Physics and Semiconductor Science
  • Dongguk University
  • University of Cambridge
  • Columbia University
  • Institute for Basic Science
  • Korea Institute of Science and Technology
  • Sungkyunkwan University
  • University of Oxford

External person

Jinhyo Lee

  • Department of Electrical and Electronic Engineering
  • Yonsei University

External person

Gi Ho Yoon

  • Sungkyul University
  • Information and Communication Engineering
  • Sungkyul University

External person

Sol Lee

  • Yonsei University
  • Institute for Basic Science
  • Department of Physics
  • Korea Basic Science Institute

External person

Juyeong Oh

  • Yonsei University
  • Korea Institute of Science and Technology
  • Department of Mechanical Engineering
  • School of Mechanical Engineering
  • Sensor System Research Center
  • School of Mechanical and Engineering

External person

Jun Seok Park

  • Kookmin University
  • Department of Electrical Engineering

External person

I. H. Kim

  • Seoul National University

External person

Joo Young Sung

  • Min. Info. Commun. Radio Res. Lab

External person

Waedeuk Kim

  • Haenglim Co., Ltd.
  • Inha University

External person

Sang Yeol Lee

  • Yonsei University

External person

Hyeon Jin Shin

  • Samsung
  • Sungkyunkwan University
  • Nano Electronics Laboratory

External person

S. H. Wi

  • Yonsei University

External person

Jae Yun Ko

  • Samsung
  • Telecommunication R and D Center

External person

Zhenwen Ding

  • Purdue University
  • School of Electrical and Computer Engineering

External person

Hyun Kim

  • Yonsei University
  • Kyung Hee University
  • Department of Diagnostic Radiology
  • Department of Electrical and Electronics Engineering

External person

Seunghyun Baik

  • Sungkyunkwan University
  • School of Mechanical Engineering
  • Department of Energy Science
  • Samsung-SKKU Graphene Center
  • School of Mechanical Engineering
  • School of Mechanical Engineering
  • School of Mechanical Engineering and Samsung-SKKU Graphene Center (SSGC)
  • IBS Center for Integrated Nanostructure Physics
  • Center for Integrated Nanostructure Physics (CINAP)
  • Institute for Basic Science (IBS)
  • SKKU Advanced Institute of Nano Technology (SAINT)
  • Institute for Basic Science

External person

Byoung Moo Lee

  • Yonsei University
  • Samsung
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering
  • Center for Information Technology

External person

Sungjae Hong

  • Yonsei University
  • Department of Physics

External person

Samuel Kim

  • Yonsei University
  • Center for Information Technology
  • Department of Electrical and Electronic Engineering

External person

Jun-Lee

  • Samsung
  • Computer Division

External person

O. K. Seo

  • Samsung
  • Opto-Mechatronics Lab.

External person

Chobi Kim

  • Korea Advanced Institute of Science and Technology

External person

Dong Hee Kim

  • Samsung
  • Communication R and D Center

External person

Seung Min Shin

  • Kyung Hee University
  • Department of Radio Engineering

External person

Ui Yong Park

  • Korean Agency for Defense Development

External person

Joonsuk Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Young Woo Son

  • Konkuk University
  • University of California at Berkeley
  • Seoul National University
  • Korea Institute for Advanced Study
  • Department of Physics
  • Department of Physics
  • School of Physics

External person

Yun Kwansoo

  • Samsung
  • EMD Center

External person

Christian Schuster

  • Hamburg University of Technology

External person

N. I. Yun

  • MyengGi Technical College

External person

Y. Charlie Hu

  • School of Electrical and Computer Engineering
  • Purdue University

External person

Seonkeol Woo

  • Kwangwoon University
  • Department of Wireless Communications Engineering

External person

Seong Yun Lee

  • Electronics and Telecommunications Research Institute
  • Radio Technology Research Department

External person

Susan R. Taub

  • University of Michigan, Ann Arbor

External person

Jianei Wang

  • University of Illinois at Chicago
  • Electrical Engineering and Computer Science Department

External person

Donald F. Kimba

  • University of California at San Diego

External person

Joongrock Kim

  • Yonsei University
  • LGE Advanced Research Institute
  • Information Display Device Laboratory
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Information Display Device Laboratory
  • Future IT Convergence Lab
  • Graduate Programs in Clean Technology
  • Center for Information Technology

External person

Joo Yong Jung

  • Yonsei University

External person

Wonseok Cho

  • Yonsei University

External person

Hyun Chul Jung

  • Korea Electronics Technology Institute
  • Electronic Materials and Device Research Center

External person

Katherine J. Henick

  • University of Michigan, Ann Arbor
  • Electrical Engineering and Computer Science Department

External person

Ho Jin Lee

  • Korea Advanced Institute of Science and Technology
  • Institute for Basic Science (IBS)

External person

Heung Cheol Yoo

  • Korean Agency for Defense Development

External person

Youngcheol Park

  • Hankuk University of Foreign Studies
  • Department of Electronics Engineering

External person

Deok Won Kim

  • LG Corporation

External person

Namcheol Jeon

  • Seoul National University
  • Department of Electrical Engineering and Computer Science

External person

Moon Kyou Kim

  • Yonsei University
  • Center for Information Technology

External person

Kyoung Joung Lee

  • Yonsei University Mirae Campus
  • Department of Biomedical Engineering
  • Institute of Medical Engineering

External person

William A. Radasky

  • Metatech Corporation

External person

Soo Kim Young

  • Kyung Hee University

External person

Tae Wook Hwang

  • Kyung Hee University

External person

Sheel Aditya

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.

External person

J. Y. Lee

  • Seoul National University

External person

Hui Sung Moon

  • Samsung
  • Sungkyunkwan University
  • Yonsei University
  • Samsung Advanced Institute of Technology
  • School of Mechanical Engineering
  • Bio Lab
  • Department of Mechanical Engineering
  • In Vitro Diagnostics Lab
  • School of Mechanical Engineering
  • Graduate School of Mechanical Engineering
  • Samsung Medical Center, Sungkyunkwan University

External person

Donghun An

  • Kwangwoon University
  • Department of Wireless Communications Engineering

External person

Shanghoon Seo

  • Samsung
  • Inkjet Business Group

External person

Myung Sik Lee

  • LIG Nex1 Co., Ltd.

External person

Youngjae Yu

  • Yonsei University

External person

J. I. Lee

  • Yonsei University
  • Dept. of Mechanical Eng.
  • School of Mechanical Engineering

External person

R. Li

  • Georgia Institute of Technology

External person

Joon Hyong Cho

  • Yonsei University
  • Korea Institute of Science and Technology
  • School of Mechanical Engineering
  • School of Mechanical Engineering
  • Sensor System Research Center
  • School of Mechanical and Engineering
  • Department of Mechanical Engineering

External person

Hosung Kang

  • Sungkyunkwan University
  • Department of Energy Science

External person

Nobutaka Kidera

  • Ashahi Glass Company

External person

Chan Ho Jeong

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Myung Hyun Park

  • Foosung Tech. Co., Ltd.

External person

Sam Yeul Choi

  • LIG Nex1 Co.
  • EM RandD Center

External person

In T. Han

  • Samsung Advanced Institute of Technology
  • Electronic Materials Laboratory
  • Materials R and D Center
  • Materials RandD Center
  • National Creative Research Initiatives Center for Electron Emission Source
  • Display Laboratory
  • Samsung
  • Inorganic Materials Lab

External person

Jaewon Choi

  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Deok Kyu Kim

  • Korean Agency for Defense Development

External person

Kazem Sabet

  • Emag Technologies

External person

Ju Ho Lee

  • Samsung Advanced Institute of Technology
  • Samsung

External person

Soo Beom Choi

  • Yonsei University
  • Graduate Program in Biomedical Engineering
  • Department of Medical Engineering
  • Cellbiocontrol Laboratory
  • BK21 Project of Medical Science
  • Brain Korea 21 Proj. for Med. Sci.

External person

Sung Jin An

  • Korea Electronics Technology Institute
  • Yonsei University

External person

T. Wu

  • Georgia Institute of Techonology
  • Georgia Institute of Technology

External person

Jae Woo Joung

  • Samsung
  • Inkjet Business Group

External person

Seung Hoon Sung

  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Yonsei University
  • Center for Information Technology
  • University of Illinois at Urbana-Champaign

External person

Dong Hoe Kim

  • Jeonju University
  • School of Electrical Engineering

External person

Sang Chul Sul

  • Samsung Advanced Institute of Technology
  • Samsung

External person

Ok Guen Lim

  • Yonsei University
  • Department of Mechanical Engineering

External person

Philip E C Stone

  • University of South Carolina
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Department of Electrical Engineering
  • UEC Electronics

External person

Sunghun Jung

  • LIG Nex1 Co., Ltd.

External person

Babak Ziaie

  • Purdue University

External person

Sanghwa Park

  • Yonsei University

External person

Jae Yeong Park

  • Yonsei University
  • LG Corporation
  • LG Electronics Inst. of Technology

External person

Myung Sun Choi

  • Yonsei University
  • Korea Association of Information and Telecommunication

External person

Yangjin Lee

  • Ulsan National Institute of Science and Technology
  • Department of Physics
  • Department of Physics
  • Yonsei University
  • Department of Physics
  • Institute for Basic Science
  • Department of Physics
  • Korea Basic Science Institute
  • Seoul National University
  • Lawrence Berkeley National Laboratory
  • University of California at Berkeley
  • Sungkyunkwan University
  • Korea Institute of Science and Technology

External person

Oh Il-Young

  • Yonsei University
  • Center for Information Technology

External person

Jae Hun Kim

  • Korea Institute of Science and Technology
  • Sensor System Research Center
  • Yonsei University
  • Ajou University

External person

Seong Geun Park

  • Yonsei University
  • Center for Information Technology

External person

Dong Wook Kim

  • Yonsei University

External person

Gwang Yong Kim

  • Yonsei University
  • Center for Information Technology

External person

Sang Tae Kim

  • Electronics and Telecommunications Research Institute
  • Radio Technology Research Department

External person

Euntaek Lim

  • Samsung
  • Telecommunication R and D Center

External person

X. Li

  • Beijing University of Posts and Telecommunications
  • International Research Laboratory Electromagnetic Theory and Application

External person

Tae Hwan Seo

  • Yonsei University
  • Center for Information Technology

External person

Il Suek Kho

  • Inha University
  • Graduate School of Information Technology and Telecommunication

External person

Hak Tae Oh

  • Min. Info. Commun. Radio Res. Lab

External person

Jae Hoon Yun

  • Electronics and Telecommunications Research Institute
  • Radio Technology Group

External person

Sung Jae Ha

  • LICT Company Ltd

External person

K. S. Lim

  • Samsung
  • Opto-Mechatronics Lab.

External person

Joon Hyung Shin

  • Gyeongsang National University

External person

Myeongjin Jang

  • Yonsei University
  • Department of Physics
  • Institute for Basic Science
  • Korea Basic Science Institute

External person

Hyo Joon Choi

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Whan Kyun Kim

  • Yonsei University
  • School of Mechanical Engineering
  • School of Mechanical Engineering
  • Department of Mechanical Engineering
  • School of Mechanical and Engineering

External person

Jeong Whan Lee

  • Samsung
  • Yonsei University

External person

Md Sakil Ibne Sayeed

  • Kyung Hee University
  • Department of Electronic and Radio Engineering

External person

S. Y. Lee

  • University of Utah
  • Samsung Advanced Institute of Technology
  • Energy and Geoscience Institute
  • Samsung
  • Sungkyunkwan University

External person

Byung Jun Ahn

  • Yonsei University
  • Center for Information Technology

External person

Ui Yong Pak

  • Korean Agency for Defense Development

External person

Chang Sung Pil

  • Inha University
  • Department of Electronic Engineering

External person

Sanghun Song

  • Yonsei University
  • Hyundai Mobis
  • Hyundai Motor Group

External person

Joo Won Kim

  • Yonsei University

External person

Jaehyun Park

  • Pohang University of Science and Technology
  • Institute for Basic Science
  • Sejong University

External person

Mi Kyung Suk

  • Electronics and Telecommunications Research Institute
  • Radio Technology Research Department

External person

Hae Jin Hwang

  • Samsung
  • Computer Division

External person

Chan Ho Kook

  • LIG Nex1 Co.
  • EW R and D Lab.
  • LIG Nex1 Co. Ltd.
  • LIG Nex1 Co., Ltd.

External person

Taegyu Bae

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Woongjae Shin

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Joong Keun Lee

  • Korea Electronics Technology Institute
  • Yonsei University
  • Electronic Materials and Device Research Center
  • Center for Information Technology

External person

Xiaodong Chen

  • Queen Mary University of London

External person

Gabriel M. Rebeiz

  • University of California at San Diego
  • IEEE
  • University of Michigan, Ann Arbor
  • Electrical and Computer Engineering Department
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Electrical Engineering and Computer Science (EECS)
  • Electrical and Computer Engineering, Department
  • Solid State Electronics Laboratory
  • Electrical Engineering and Computer Science Department

External person

Ik Soon Jang

  • Korea Basic Science Institute
  • Division of Bioconvergence
  • Proteome Research Team
  • Division of Life Science
  • Biological Disaster Analysis Group
  • University of Science and Technology UST

External person

Jae Hyuk Kang

  • Yonsei University

External person

Sung Sil Cho

  • Kongju National University

External person

Jong Soon Choi

  • Korea Basic Science Institute
  • Chungnam National University
  • Division of Bioconvergence
  • Graduate School of Analytical Science and Technology
  • Division of Life Science
  • Graduate School of Energy Science and Technology
  • Biological Disaster Analysis Group
  • Proteome Research Team

External person

Naofumi Homma

  • Tohoku University

External person

Joong Sik Kih

  • Hynix Semiconductor Inc.
  • Signal Integrity Part. Division of Memory RandD
  • SK Corporation

External person

K. S. Seo

  • Seoul National University
  • School of Electrical Engineering
  • School of Electrical Engineering
  • Department of Electrical Engineering and Computer Science
  • School of Electrical Engineering
  • School of Electrical Engineering
  • Korea Advanced Nano Fab Center

External person

Lee Hee-Jo

  • Yonsei University
  • Center for Information Technology

External person

Hae Moon Seo

  • Korea Electronics Technology Institute
  • System Packaging Center

External person

Haeng Lyul Lee

  • Yonsei University
  • Center for Information Technology

External person

Namkon Lee

  • Korean Institute of Civil Engineering and Building Technology

External person

Sungwook Kim

  • Korean Institute of Civil Engineering and Building Technology

External person

Hyung Jun Lee

  • Yonsei University

External person

Hyungsoo Kim

  • Hynix Semiconductor Inc.
  • SK Corporation
  • Signal Integrity Part. Division of Memory RandD
  • Department of Biochemistry and Molecular Biology
  • Seoul National University
  • Interdisciplinary Program in Genetic Engineering

External person

Joung Jae Woo

  • Samsung
  • EMD Center

External person

Stephen V. Robertson

  • University of Michigan, Ann Arbor
  • Electrical Engineering and Computer Science Department

External person

Jun Kyu Yang

  • Radio Research Agency
  • Department of Radio Environment Safety

External person

Sang Ouk Kim

  • Korea Advanced Institute of Science and Technology
  • Institute for Basic Science (IBS)
  • National Creative Research Initiative Center
  • Laboratory of Optical Materials and Coating (LOMC)

External person

Youngju Kim

  • Dongwoo Fine-Chem

External person

Chang Ui Hong

  • Yonsei University

External person

Yun Hwi Park

  • Korea Electronics Technology Institute
  • Samsung
  • Electro Material and Device Lab.

External person

J. S. Jang

  • Yonsei University
  • Center for Information Technology

External person

Jai Rim Yuk

  • Yonsei University
  • Center for Information Technology

External person

Ray S. Martin

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Hong Wang

  • Nanyang Technological University
  • Sch. of Elec. and Electron. Eng.

External person

Jong Min Yook

  • Korea Electronics Technology Institute
  • ICT Device Packaging Research Center

External person

Y. C. Kim

  • Samsung Advanced Institute of Technology
  • Samsung

External person

Jeong Ho Lee

  • Yonsei University
  • School of Electrical and Electronic Engineering

External person

Young Hun Kim

  • Korea Electronics Technology Institute
  • Samsung

External person

Katherine J. Herrick

  • University of Michigan, Ann Arbor
  • IEEE
  • Raytheon
  • Electrical Engineering and Computer Science Department

External person

Sang Wook Kim

  • Hanyang University
  • Yonsei University
  • Isung Engineering Co., Ltd.
  • Samsung
  • Kangwon National University
  • IBM
  • Sungkyunkwan University
  • College of Information and Communications
  • Department of Electronics and Computer Engineering
  • Department of Internal Medicine
  • Department of Internal Medicine
  • Comp. Systems and Reliable SoC LEEE
  • Division of Information and Communications
  • Dept. Comp., Info., and Commun. Eng.
  • Dept. of Electronics and Computer and Engineering
  • R and D Division
  • Advanced Technology Development Team
  • Department of Computer Science
  • Ajou University
  • Dept. of Molecular Science and Technology

External person

Seungjae Lee

  • Hanyang University

External person

Jun Chul Kim

  • Korea Electronics Technology Institute
  • ICT Device Packaging Research Center

External person

Yong Duck Kim

  • ACE Technology Corporation

External person

Kyoung Bo Han

  • Yonsei University
  • Department of Electrical Engineering

External person

Dong Ju Sim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Seyoul Choi

  • Korean Agency for Defense Development

External person

Chang Hyun Lim

  • Yonsei University
  • Dept. of Mechanical Eng.
  • School of Mechanical Engineering
  • School of Mechanical Engineering

External person

Seongrak Kim

  • Korea Advanced Institute of Science and Technology

External person

N. I. Dib

  • University of Michigan, Ann Arbor

External person

Kibum Jung

  • EnR Tech.

External person

Ji Yoong Kang

  • Yonsei University
  • School of Mechanical and Engineering
  • School of Mechanical Engineering
  • School of Mechanical Engineering

External person

Sang Hoon Jeon

  • Knowledge ON Semiconductor Inc.

External person

K. Sarabandi

  • Emag Technologies

External person

Tentzeris Emmanouil

  • IEEE
  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Y. J. Hwang

  • Yonsei University
  • Dept. of Electronics Engineering

External person

Dongpil Park

  • Dongwoo Fine-Chem

External person

Young Mo Jung

  • Yonsei University
  • Korea Institute of Science and Technology
  • Department of Mechanical Engineering
  • Sensor System Research Center
  • School of Mechanical Engineering
  • School of Mechanical Engineering
  • Department of Materials Science and Engineering
  • School of Mechanical and Engineering

External person

Murali Bissannagari

  • Division of Advanced Materials Engineering
  • Kongju National University

External person

Youn Hui Jang

  • Korean Agency for Defense Development

External person

Yoon Jae Kim

  • Korean Agency for Defense Development

External person

Mingook Jung

  • Yonsei University
  • Department of Mechanical Engineering
  • Graduate School of Mechanical Engineering
  • Korean Agency for Defense Development

External person

Seul Gi Ko

  • Yonsei University

External person

Y. J. Kim

  • Yonsei University
  • Department of Mechanical Engineering

External person

Gyoungdeuk Kim

  • Pusan National University

External person

Gang San Lee

  • Korea Advanced Institute of Science and Technology

External person

Jaekon Shin

  • Korea Transportation Safety Authority
  • Korea Automobile Testing and Research Institute

External person

Kyung Hyun Oh

  • Samsung Thales

External person

Myoung Won Lee

  • Jeonju University
  • School of Electrical Engineering

External person

Hyeok Kim

  • Korea Electronics Technology Institute
  • Hankuk University of Foreign Studies
  • ICT Device Packaging Research Center
  • Department of Electronics Engineering

External person

Cheol Koo Hahn

  • Korea Electronics Technology Institute
  • System Packaging Center

External person

Cheol Mon

  • Jeonju University
  • School of Electrical Engineering

External person

Joo Yong Kim

  • Korea Electronics Technology Institute
  • Samsung
  • Electro Material and Device Lab.

External person

Lilly Huang

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory

External person

Hee Jung Kim

  • Yonsei University
  • Department of Electrical and Electronic Engineering

External person

Yong Ju Kim

  • Hynix Semiconductor Inc.
  • Signal Integrity Part. Division of Memory RandD
  • SK Corporation

External person